Application of Laser Particle Size Analyzer in Silicon Carbide

Silicon carbide is widely used in power electronics, abrasives, ceramics, and semiconductors due to its high hardness, high temperature and corrosion resistance, high thermal conductivity, and excellent semiconductor properties. Testing silicon carbide particle size distribution is crucial to its performance and applications.

1. In the field of abrasives and grinding tools, particle size determines cutting efficiency and surface finish.

2. In ceramics or refractory materials, uniform particle size improves sintering density and mechanical strength.

3. In semiconductors and electronic devices, the particle size of nano-silicon carbide affects thermal conductivity and interfacial bonding properties.

Laser particle size analyzers can monitor batch stability during the production process, optimize processes such as crushing and grading, and avoid sintering defects or performance fluctuations caused by uneven particle size. Therefore, the laser particle size analyzer is an indispensable tool for silicon carbide quality control, process improvement and high-end application development.

A high-performance laser particle size analyzer has the advantages of easy operation, fast test speed, good repeatability and accuracy. This time, Winner2006 is recommended to test the particle size distribution of silicon carbide for customers.

Winner2006 is mainly used to measure the particle size distribution of particles in solid powders or emulsions, such as cement, ceramics, aerosols, suspensions, etc.

Performance Advantage:

1. Large range: The measurement range of Winner2006 is 0.01-1000μm.

2. Wet particle circulation device/optical path automatic centering system: ensures that particles are always in a dynamic dispersion state, and particle size analysis is not limited by any function.

3. Fully automatic mode: The intelligent instrument can test samples with one click.

Measuring instrument information is as follows:

The video of measuring nanoparticles is as follows：